• Good with low current density systems.|
• No moving parts required.
• Can be coupled with convective cooling methods.
• There is a limit to how much heat transfer material is to be used.|
• Not suitable for high current density values.
• Significant increase in system weight if more heat conductive material is added.
• Eddy currents in case of excess material  and from changing fields
• Cooling medium is readily available.|
• Can easily be coupled with conductive cooling and indirect liquid cooling.
• Dry method hence no fear of shocks from leakage.
• Limited to current densities of 2 A/mm2.|
• Low coefficient of heat transfer (between 2.5–10 (natural convection) 10–500 W/m2K (forced convection) ).
• Often bulky with high space requirements.
• Relatively high coefficient of heat transfer (100–15,000 W/m2K )|
• Compact design is possible hence lower space requirements.
• No thermal barriers when direct cooling through hollow conductors is used
• Possible electric shocks in case of leakages|
• Corrosion of cooling channels due to high flow rate and pressure requirements
• Additional power and operational costs from pumping